Engineering Firm Needed for Electronics Enclosure and Thermal Prototype

A hardware developer is seeking an engineering partner to design and prototype an enclosure for a compact industrial electronics product. The project includes mechanical architecture, component packaging, thermal management, environmental sealing and preparation for low-volume manufacturing.

The engineering firm should review existing electronics and interface requirements, develop concepts, complete detailed CAD, coordinate prototype fabrication and support design verification. Proposals should identify project phases, estimated hours or fixed fees, prototype costs, schedule, deliverables and experience with industrial electronic products.

Published by the B2Base based on common business procurement needs.

The enclosure must accommodate the supplied PCB assembly, connectors, indicators and mounting requirements while meeting defined temperature and ingress targets. Material and manufacturing recommendations should consider quantities from prototype through several thousand units annually. Deliverables must include editable CAD, drawings, bill of materials, tolerance notes and prototype test findings. Intellectual property, source files and design outputs must transfer to the buyer upon payment.